For downhole casing integrity applications, high-resolution acoustic imaging is a novel approach for quantifying casing thickness, corrosion, and mechanical damage defects by measuring both inner diameterand outer diameter wall losses. The technology deploys high-density solid-state arrays with up to 512 transducers to achieve sub-degree azimuthal and sub-millimetric axial resolutions with casing thickness measurements down to a minimum thickness of 0.07 in with an error of ±0.005-in. In this study, we discuss the technological advancements, details of laboratory validation results, exploration of burst pressure calculation methodologies, and a field case study based on the novel technology.

Speaker:

Chris McCann - DarkVision

Event Format:

Lunch-and-Learn  at NexTiers Headquarters West-side of Houston. Several food options will be provided for those with various dietary needs. Parking is free. Doors open at 11:30 AM for networking.